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? 2011 microchip technology inc. ds21743b-page 1 tc72 features ? temperature-to-digital converter ? spi compatible interface ? 10-bit resolution (0.25c/bit) ? 2c (maximum) accuracy from -40c to +85c ? 3c (maximum) accuracy from -55c to +125c ? 2.65v to 5.5v operating range ? low power consumption: - 250 a (typical) continuous temperature conversion mode - 1 a (maximum) shutdown mode ? power saving one-shot temperature measurement ? industry standard 8-pin msop package ? space saving 8-pin dfn (3x3 mm) package typical applications ? personal computers and servers ? hard disk drives and other pc peripherals ? entertainment systems ? office equipment ? datacom equipment ? mobile phones ? general purpose temperature monitoring package types general description tc72 is a digital temperature sensor capable of reading temperatures from -55c to +125c. this sensor features a serial interface that allows communication with a host controller or other peripherals. the tc72 interface is compatible with the spi protocol, and does not require any additional external components. however, it is recommended that a decoupling capacitor of 0.01 f to 0.1 f be provided between the v dd and gnd pins. tc72 can be used either in a continuous temperature conversion mode or a one-shot conversion mode. the continuous conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. in contrast, the one-shot mode performs a single temperature measurement and returns to the power saving shutdown mode. tc72 features high temperature accuracy, ease-of-use and is the ideal solution for implementing thermal management in a variety of systems. the device is available in both 8-pin msop and 8-pin dfn space- saving packages. tc72 also features a shutdown mode for low power operation. block diagram sck ce gnd nc sdi 1 2 3 4 8 7 6 5 sdo v dd nc tc72 3x3 dfn* ce sck gnd nc sdo 1 2 3 4 8 7 6 5 sdi v dd nc ep 9 * includes exposed thermal pad (ep); see table 3-1 . tc72 msop tc72 diode temperature sensor v dd sck ce serial port interface 10-bit sigma delta a/d converter register temperature register internal control manufacturer id register gnd sdo sdi digital temperature sensor with spi interfa ce
tc72 ds21743b-page 2 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 3 tc72 1.0 electrical characteristics 1.1 maximum ratings ? v dd ........................................................................ 6.0v all inputs and outputs w.r.t. gnd ...-0.3v to v dd +0.3v storage temperature .......................... -65c to +150c ambient temp. with power applied ..... -55c to +125c junction temperature ........................................ 150c esd protection on all pins: human body model (hbm)............................. > 4 kv man machine model (mm)............................. > 400v latch-up current at each pin ........................ 200 ma maximum power dissipation........................... 250 mw ? notice: stresses above those listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specific ation is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, all parameters apply at v dd = 2.65v to 5.5v, t a = -55c to +125c. parameters sym min typ max units conditions power supply operating voltage range v dd 2.65 ? 5.5 v note 1 operating current: normal mode, adc active i dd-con ? 250 400 a continuous temperature conversion mode (shutdown bit = ? 0 ?) shut-down supply current i shd ? 0.1 1.0 a shutdown mode (shutdown bit = ? 1 ?) temperature sensor and analog-to-digital converter temperature accuracy ( note 1 ) t acy -2.0 ? +2.0 c -40c < t a < +85c -3.0 ? +3.0 -55c < t a < +125c resolution ? 10 ? bits note 4 adc conversion time t conv ? 150 200 ms digital input / output high level input voltage v ih 0.7 v dd ?? v low level input voltage v il ??0.2 v dd v high level output voltage v oh 0.7 v dd ?? vi oh = 1 ma low level output voltage v ol ??0.2 v dd vi ol = 4 ma input resistance r in 1.0 ? ? m pin capacitance c in ?15?pf c out ?50? note 1: the tc72-2.8mxx, tc72-3.3mxx and tc72-5.0mxx will operate from a supply voltage of 2.65v to 5.5v. however, the tc72-2.8mxx, tc72-3.3mxx and tc72-5.0mxx are tested and specified at the nominal operating voltages of 2.8v, 3.3v and 5.0v respectively. as v dd varies from the nominal operating value, the accuracy may be degraded. refer to figure 2-5 and figure 2-6 . 2: measured with a load of c l = 50 pf on the sdo output pin of the tc72. 3: all time measurements are measured with respect to the 50% point of the signal, except for the sck rise and fall times. the rise and fall times are defined as the 10% to 90% transition time. 4: resolution = temperature range/no. of bits = (+127c ? -128c) / (2 10 ) = 256/1024 = 0.25c/bit
tc72 ds21743b-page 4 ? 2011 microchip technology inc. serial port ac timing ( note 2 , 3 ) clock frequency f clk dc ? 7.5 mhz sck low time t cl 65 ? ? ns sck high time t ch 65 ? ? ns ce to sck setup t cc 400 ? ? ns sck to data out valid t cdd ? ? 55 ns ce to output tri-state t cdz ? ? 40 ns sck to data hold time t cdh 35 ? ? ns data to sck set-up time t dc 35 ? ? ns sck to ce hold time t cch 100 ? ? ns sck rise time t r ??200ns sck fall time t f ??200ns ce inactive time t cwh 400 ? ? ns temperature specification electrical specifications: unless otherwise noted, all parameters apply at v dd = 2.65v to 5.5v, t a = -55c to +125c. parameters sym min typ max units conditions temperature ranges specified temperature range t a -55 ? +125 c operating temperature range t a -55 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance 8-l 3x3 dfn ja ?56.7?c/w thermal resistance 8-l msop ja ?211?c/w dc characteristics (continued) electrical specifications: unless otherwise noted, all parameters apply at v dd = 2.65v to 5.5v, t a = -55c to +125c. parameters sym min typ max units conditions note 1: the tc72-2.8mxx, tc72-3.3mxx and tc72-5.0mxx will operate from a supply voltage of 2.65v to 5.5v. however, the tc72-2.8mxx, tc72-3.3mxx and tc72-5.0mxx are tested and specified at the nominal operating voltages of 2.8v, 3.3v and 5.0v respectively. as v dd varies from the nominal operating value, the accuracy may be degraded. refer to figure 2-5 and figure 2-6 . 2: measured with a load of c l = 50 pf on the sdo output pin of the tc72. 3: all time measurements are measured with respect to the 50% point of the signal, except for the sck rise and fall times. the rise and fall times are defined as the 10% to 90% transition time. 4: resolution = temperature range/no. of bits = (+127c ? -128c) / (2 10 ) = 256/1024 = 0.25c/bit
? 2011 microchip technology inc. ds21743b-page 5 tc72 figure 1-1: serial port timing diagrams. ce 1/f clk t cl t ch d7 d0 high z sdi spi read data transfer ce 1/f clk t cc a7 = 1 t cl t ch d7 d0 sdi a0 a7 t dc t cdh a0 t f t r t dc t cdh t r t f sck t cc (cp = 0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7 = 0) (cp = 0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7 = 1) t cdd sdo sck t cch t cwh t cdz high z t cwh t cch note: the timing diagram is drawn with cp = 0. the tc72 also functions with cp = 1; however, the edges of sck are reversed as defined in table 4-3 and figure 4-2 . spi write data transfer msb lsb msb lsb msb lsb msb lsb
tc72 ds21743b-page 6 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 7 tc72 2.0 typical performance curves note: unless otherwise indicated, all parameters apply at v dd = 2.65v to 5.5v, t a = -55c to +125c. figure 2-1: accuracy vs. temperature (tc72-x.xmxx). figure 2-2: supply current vs. supply voltage. figure 2-3: supply current vs. temperature. figure 2-4: shutdown current vs. temperature. figure 2-5: temperature accuracy vs. supply voltage (tc72-2.8mxx). figure 2-6: temperature accuracy vs. supply voltage (tc72-5.0mxx). note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 -55 -25 5 35 65 95 125 reference temperature (c) temperature error (c) lower specification limit upper specification limit mean + 3 mean - 3 mean 200 210 220 230 240 250 260 2.5 3.0 3.5 4.0 4.5 5.0 5.5 supply current (a) supply voltage (v) t a = +25c t a = +125c t a = -55c tc72-x.xmxx 0 50 100 150 200 250 300 350 400 -55 -25 5 35 65 95 125 supply current (ua) temperature (c) tc72-5.0mxx v dd = 5.0v tc72-3.3mxx v dd = 3.3v tc72-2.8mxx v dd = 2.8v 0.00 0.05 0.10 0.15 0.20 -55 -25 5 35 65 95 125 shutdown current (a) temperature (c) tc72-5.0mxx v dd = 5.0v tc72-5.0mxx v dd = 2.8v tc72-3.3mxx v dd = 3.3v -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 2.6 2.7 2.8 2.9 3.0 temperature change (c) supply voltage (v) t a = +25c t a = -25c t a = +85c tc72-2.8mxx -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 temperature change (c) supply voltage (v) t a = +25c t a = -25c t a = +85c tc72-5.0mxx
tc72 ds21743b-page 8 ? 2011 microchip technology inc. note: unless otherwise indicated, all parameters apply at v dd = 2.65v to 5.5v, t a = -55c to +125c. figure 2-7: histogram of temperature accuracy at -55 degrees c. figure 2-8: histogram of temperature accuracy at -40 degrees c. figure 2-9: histogram of temperature accuracy at +25 degrees c. figure 2-10: histogram of temperature accuracy at +65 degrees c. figure 2-11: histogram of temperature accuracy at +85 degrees c. figure 2-12: histogram of temperature accuracy at +125 degrees c. 0 5 10 15 20 25 30 35 40 45 50 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = -55c 0 10 20 30 40 50 60 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = -40c 0 10 20 30 40 50 60 -1.50 -1.25 -1.00 -0.75 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = +25c 0 10 20 30 40 50 60 -1.50 -1.25 -1.00 -0.75 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = +65c 0 5 10 15 20 25 30 35 40 45 50 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = +85c 0 5 10 15 20 25 30 35 40 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 percentage of occurances (%) temperature error (c) tc72-x.xmxx sample size = 166 t a = +125c
? 2011 microchip technology inc. ds21743b-page 9 tc72 3.0 pin description pin functionalities are described in ta b l e 3 - 1 . 3.1 no connection (nc) this pin is not internally connected to the die. 3.2 serial clock input (sck) the sck pin is an input pin. all communication and timing is relative to the signal on this pin. the clock is generated by the host controller on the spi bus (see section 4.3 ?serial bus interface? ). 3.3 chip enable input (ce) the ce is a chip enable pin. this is an active high input, therefore the device is enabled when ce is toggled to v dd . once the device is enabled, all serial communication begins (see section 4.3 ?serial bus interface? ). 3.4 ground (gnd) the gnd is the system ground pin. 3.5 serial data input (sdi) the sdi is a data input pin, used to transmit data from the host to the device (see section 4.3 ?serial bus interface? ). 3.6 serial data output (sdo) the sdo is a data output pin, used to transmit data from the device to the host (see section 4.3 ?serial bus interface? ). 3.7 power supply (v dd ) v dd is the power pin. the operating voltage range, as specified in the dc electrical specification table, is applied on this pin. 3.8 exposed pad (ep) there is an internal electrical connection between the exposed thermal pad (ep) and the gnd pin; they can be connected to the same potential on the printed circuit board (pcb). this provides better thermal conduction from the pcb to the die. table 3-1: pin function table tc72 symbol function 3x3 dfn msop 1 1 nc no internal connection 2 3 sck serial clock input 3 2 ce chip enable input, the device is selected when this input is high 4 4 gnd ground 5 6 sdi serial data input 6 5 sdo serial data output 7 7 nc no internal connection 88v dd power supply 9 ? ep exposed pad (ground)
tc72 ds21743b-page 10 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 11 tc72 4.0 functional description tc72 consists of a band-gap type temperature sensor, a 10-bit sigma delta analog-to-digital converter (adc), an internal conversion oscillator and a double buffer digital output port. the 10-bit adc is scaled from -128c to +127c; therefore, the resolution is 0.25c per bit. the ambient temperature operating range of the tc72 is specified from -55c to +125c. this device features a four-wire serial interface that is fully compatible with the spi specification and, there- fore, allows simple communications with common microcontrollers and processors. tc72 can be used either in a continuous temperature conversion mode or a one-shot conversion mode. tc72 temperature measurements are performed in the background and, therefore, reading the temperature via the serial i/o lines does not affect the measurement in progress. the continuous conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. tc72 has an internal clock generator that controls the automatic temperature conversion sequence. the automatic temperature sampling operation is repeated indefinitely until tc72 is placed in shutdown mode by a write operation to the control register. tc72 will remain in shutdown mode until the shutdown bit in the control register is reset. in contrast, the one-shot mode performs a single temperature measurement and returns to the power- saving shut down mode. this mode is especially useful for low power applications. figure 4-1: temperature-to-digital transfer function (non-linear scale). te m p te m p output code +125c -55c +25c -25c +0.25c -0.125c 0111 1101 / 0000 0000 msb lsb note: the adc converter is scaled from -128c to +127c, but the operating range of the tc72 is specified from -55c to +125c. 0001 1001 / 0000 0000 msb lsb 0000 0000 / 0100 0000 msb lsb 0000 0000 / 0000 0000 msb lsb 1111 1111 / 1100 0000 msb lsb 1110 0111 / 0000 0000 msb lsb 1100 1001 / 0000 0000 msb lsb 0c
tc72 ds21743b-page 12 ? 2011 microchip technology inc. 4.1 temperature data format temperature data is represented by a 10-bit two?s com- plement word with a resolution of 0.25c per bit. the temperature data is stored in the temperature registers in a two?s complement format. the adc converter is scaled from -128c to +127c, but the operating range of tc72 is specified from -55c to +125c. example 4-1: table 4-1: tc72 temperature output data table 4-2: temperature register 4.2 power-up and power-down tc72 is in low-power consumption shutdown mode at power-up. the continuous temperature conversion mode is selected by performing a write operation to the control register, as described in section 5.0 ?internal register structure? . a supply voltage lower than 1.6v (typical) is considered a power-down state for tc72. if the supply voltage drops below the 1.6v threshold, the internal registers are reset to the power-up default state. 4.3 serial bus interface the serial interface consists of the chip enable (ce), serial clock (sck), serial data input (sdi) and serial data output (sdo) signals. tc72 operates as a slave and is compatible with the spi bus specifications. the serial interface is designed to be compatible with the microchip pic ? family of microcontrollers. the ce input is used to select tc72 when multiple devices are connected to the serial clock and data lines. the ce is active-high, and data is written to or read from the device, when ce is equal to a logic high voltage. the sck input is disabled when ce is low. the rising edge of the ce line initiates a read or write operation, while the falling edge of ce completes a read or write operation. the sck input is provided by the external microcontroller and is used to synchronize the data on the sdi and sdo lines. the sdi input writes data into tc72?s control register, while the sdo outputs the temperature data from the temperature register and the status of shutdown bit of the control register. tc72 has the capability to function with either an active-high or low sck input. the sck inactive state is detected when the ce signal goes high, while the polarity of the clock input (cp) determines whether the data is clocked and shifted on either the rising or falling edge of the system clock, as shown in figure 4-2 . table 4-3 gives the appropriate clock edge used to transfer data into and out of the registers. each data bit is transferred at each clock pulse, and the data bits are clocked in groups of eight bits, as shown in figure 4-3 . the address byte is transferred first, followed by the data. a7, the msb of the address, determines whether a read or write operation will occur. if a7 = ? 0 ?, one or more read cycles will occur; otherwise, if a7 = ? 1 ?, one or more write cycles will occur. data can be transferred either in a single byte or a multi-byte packet, as shown in figure 4-3 . in the 3-byte packet, the data sequence consists of the msb temperature data, lsb temperature data, followed by the control register data. the multi-byte read feature is initiated by writing the highest address of the desired packet to registers. tc72 will automatically send the register addressed and all of the lower address registers, as long as the chip enable pin is held active. temperature binary msb / lsb hex +125c 0111 1101/0000 0000 7d00 +25c 0001 1001/0000 0000 1900 +0.5c 0000 0000/1000 0000 0080 +0.25c 0000 0000/0100 0000 0040 0c 0000 0000/0000 0000 0000 -0.25c 1111 1111/1100 0000 ffc0 -25c 1110 0111/0000 0000 e700 -55c 1100 1001/0000 0000 c900 d7 d6 d5 d4 d3 d2 d1 d0 address/ register sign 2 6 2 5 2 4 2 3 2 3 2 1 2 0 02h te m p . m s b 2 -1 2 -2 000000 01h te m p . l s b temperature = +41.5c msb temperature register = 00101001b =2 5 + 2 3 + 2 0 = 32 + 8 + 1 = 41 lsb temperature register = 10000000b = 2 -1 = 0.5
? 2011 microchip technology inc. ds21743b-page 13 tc72 table 4-3: operational modes 4.4 read operation the tc72 uses the ce, sck and sdo lines to output the temperature and control register data. figure 4-3 shows a timing diagram of the read operation. communication is initiated by the chip enable (ce) going high. the sdo line remains at the voltage level of the lsb bit that is output and goes to the tri-state level when the ce line goes to a logic low level. 4.5 write operation data is clocked into the control register in order to enable tc72?s power saving shutdown mode. the write operation is shown in figure 4-3 and is accomplished using the ce, sck and sdi lines. figure 4-2: serial clock polarity (cp) operation. mode ce sck ( note 1 )sdisdo disable l input disabled input disabled high z write (a7 = 1 )hcp= 1 , data shifted on falling edge, data clocked on rising edge data bit latch high z cp= 0 , data shifted on rising edge, data clocked on falling edge read (a7 = 0 )hcp= 1 , data shifted on falling edge, data clocked on rising edge x next data bit shift, note 2 cp= 0 , data shifted on rising edge, data clocked on falling edge note 1: cp is the clock polarity of the microcontroller system clock. if the inactive state of sck is logic level high, cp is equal to ? 1 ?; otherwise, if the inactive state of sck is low, cp is equal to ? 0 ?. 2: during a read operation, sdo remains at a high impedance (high z) level until the eight bits of data begin to be shifted out of the temperature register. shift edge clock edge shift edge clock edge sck ce ce sck cp = 0 cp = 1
tc72 ds21743b-page 14 ? 2011 microchip technology inc. figure 4-3: serial interface timing diagrams (cp=0). a 1 sck sdi sdo high z a7=1 ce single byte write operation (cp=0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7=1) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 a a a a a a a d d d d d d d d 7654321076543210 msb lsb single byte read operation (cp=0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7=0) ce a 1 sck sdi a7=0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 a a a a a a a d d sdo high z high z 76543210 msb lsb 70 spi multiple byte transfer ce sck write operation (cp=0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7=1) sdi address byte = 80hex high z sdo control byte a7 a0 d7 d0 read operation (cp=0, data shifted on rising edge of sck, data clocked on falling edge of sck, a7=0) sdi sdo high z high z msb temp. byte lsb temp. byte address byte = 02hex control byte a7 a0 d7 d0 d7 d0 d7 d0
? 2011 microchip technology inc. ds21743b-page 15 tc72 5.0 internal register structure tc72 registers are listed below. table 5-1: registers for tc72 5.1 control register the control register is both a read and a write register that is used to select either the shutdown, continuous or one-shot conversion operating mode. the temper- ature conversion mode selection logic is shown in table 5-2 . the shutdown (shdn) bit is stored in bit 0 of the control register. if shdn is equal to ? 1 ?, tc72 will go into power-saving shutdown mode. if shdn is equal to ? 0 ?, tc72 will perform a temperature conversion approximately every 150 ms. at power-up, the shdn bit is set to ? 1 ?. thus, tc72 is in shutdown operating mode at startup. continuous temperature conversion mode is selected by writing a ? 0 ? to the shdn bit of the control register. shutdown mode can be used to minimize the power consumption of tc72 when active temperature monitoring is not required. the shutdown mode disables the temperature conversion circuitry; however, the serial i/o communication port remains active. a temperature conversion will be initialized by a write operation to the control register to select either the continuous temperature conversion or the one- shot operating mode. the temperature data will be available in the msb and lsb temperature registers approximately 150 ms after the control register write operation. one-shot mode is selected by writing a ? 1 ? into bit 4 of the control register. the one-shot mode performs a single temperature measurement and returns to the power-saving shutdown mode. after completion of the temperature conversion, the one-shot bit (os) is reset to ? 0 ? (i.e. ?off?). the user must set the one-shot bit to ? 1 ? to initiate another temperature conversion. bits 1, 3, 5, 6 and 7 of the control register are not used by tc72. bit 2 is set to a logic ? 1 ?. any write operation to these bit locations will have no affect on the operation of tc72. 5.2 temperature register the temperature register is a read-only register and contains a 10-bit two?s complement representation of the temperature measurement. bit 0 through bit 5 of the lsb temperature register are always set to a logic ? 0 ?. at power-on reset (por) or a brown-out reset (bor) low voltage occurrence, the temperature regis- ter is reset to all zeroes, which corresponds to a tem- perature value of 0c. a v dd power supply less than 1.6v is considered a reset event and will reset the temperature register to the power-up state. 5.3 manufacturer id register the manufacturer identification (id) register is a read- only register used to identify the temperature sensor as a microchip component. table 5-2: control register temper ature conversion mode selection register read address write address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 value on por/bor control 00hex 80hex 000 one-shot (os) 010 shutdown (shdn) 05hex lsb temperature 01hex n/a t1 t0 0 0 000 0 00hex msb temperature 02hex n/a t9 t8 t7 t6 t5 t4 t3 t2 00hex manufacturer id 03hex n/a 010 1 010 0 54hex operational mode one-shot (os) bit 4 shutdown (shdn) bit 0 continuous temperature conversion 00 shutdown 01 continuous temperature conversion (one-shot command is ignored if shdn = ? 0 ?) 10 one-shot 11
tc72 ds21743b-page 16 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 17 tc72 6.0 applications information the tc72 does not require any additional components in order to measure temperature; however, it is recommended that a decoupling capacitor of 0.1mf to 1mf be provided between the v dd and gnd pins. although the current consumption of the tc72 is modest (250 ma, typical), the tc72 contains an on chip data acquisition with internal digital switching circuitry. thus, it is considered good design practice to use an external decoupling capacitor with the sensor. a high frequency ceramic capacitor should be used and be located as close as possible to the ic power pins in order to provide effective noise protection to the tc72. the tc72 measures temperature by monitoring the voltage of a diode located on the ic die. the ic pins of the tc72 provide a low impedance thermal path between the die and the pcb, allowing the tc72 to effectively monitor the temperature of the pcb board. the thermal path between the ambient air is not as efficient because the plastic ic housing package functions as a thermal insulator. thus, the ambient air temperature (assuming that a large temperature gradient exists between the air and pcb) has only a small effect on the temperature measured by the tc72. note that the exposed metal center pad on the bottom of the dfn package is connected to the silicon substrate. the center pad should be connected to either the pcb ground plane or treated as a ?no connect? pin. the mechanical dimensions of the center pad are given in section 7.0 ?packaging information? of this data sheet. a potential for self-heating errors can exist if the tc72 spi communication lines are heavily loaded. typically, the self-heating error is negligible because of the relatively small current consumption of the tc72. a temperature accuracy error of approximately +0.5c will result from self-heating if the spi communication pins sink/source the maximum current specified for the tc72. thus, to maximize temperature accuracy, the output loading of the spi signals should be minimized. figure 6-1: typical application. i/o sck sdi ce sck sdo tc72 0.1f v dd gnd v dd picmicro ? mcu sdo sdi
tc72 ds21743b-page 18 ? 2011 microchip technology inc. 7.0 packaging information 7.1 package marking information 8-lead dfn example : xxxxxxxx myww nnn 7228 m109 256 8-lead msop example: xxxxxx ywwnnn tc722m 109256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
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tc72 ds21743b-page 20 ? 2011 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2011 microchip technology inc. ds21743b-page 21 tc72 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
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? 2011 microchip technology inc. ds21743b-page 23 tc72 appendix a: revision history revision b (july 2011) the following is the list of modifications: 1. updated dfn pin drawing. 2. added new chapter section 3.0 ?pin description? . 3. moved typical application figure in section 6.0 ?applications information? (see figure 6-1 ). 4. updated section 7.0 ?packaging information? revision a (october 2002) ? original data sheet for the tc72 device.
tc72 ds21743b-page 24 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 25 tc72 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . part no. x /xx xx voltage package temperature range device device: tc72: digital temperature sensor w/spi interface voltage range: 2.8 = accuracy optimized for 2.8v 3.3 = accuracy optimized for 3.3v 5.0 = accuracy optimized for 5.0v temperature range: m =-55c to +125c package: mf = dual, flat, no lead (dfn) (3x3mm), 8-lead mftr = dual, flat, no lead (dfn) (3x3mm), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead uatr = plastic micro small outline (msop), 8-lead (tape and reel) examples: a) tc72-2.8mua: digital temperature sensor, 2.8v, 8ld msop package. b) tc72-2.8muatr: digital temperature sensor, 2.8v, 8ld msop (tape and reel) package. c) tc72-2.8mmf: digital temperature sensor, 2.8v, 8ld dfn package. d) tc72-3.3mua: digital temperature sensor, 3.3v, 8ld msop package. e) tc72-3.3mmf: digital temperature sensor, 3.3v, 8ld dfn package. f) tc72-5.0mua: digital temperature sensor, 5.0v, 8ld msop package. g) tc72-5.0mmf: digital temperature sensor, 5.0v, 8ld dfn package. h) tc72-5.0mmftr: digital temperature sensor, 5.0v, 8ld dfn (tape and reel) package. range
tc72 ds21743b-page 26 ? 2011 microchip technology inc. notes:
? 2011 microchip technology inc. ds21743b-page 27 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, total endurance, tsharc, uniwindriver, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2011, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-61341-429-3 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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